Opened 7 years ago

Closed 3 years ago

#2881 closed defect (fixed)

Removing the cable from CN22 is made more difficult by the solder bump

Reported by: jg Owned by: vance.ke
Priority: normal Milestone: 8.2.0 (was Update.2)
Component: manufacturing process Version: 1.0-hardware-B4
Keywords: Cc: mlj, danerogers
Blocked By: Blocking:
Deployments affected: Action Needed: never set
Verified: no

Description

See: http://wiki.laptop.org/images/2/25/OLPC_BR_Audit.pdf

Connectors CN25 and CN26 are identical to CN22. Removing the cables from CN25 and CN26 is straight forward. However, removing the cable from CN22 is made more difficult by the solder bump from a feed through just in front of the female end.

The locking detent feature is a bump on the bottom of the female connector and when pulled out, the detent needs to ride up out of its notch and will tip the outside edge down. The solder bump interferes with this motion and makes it difficult to withdraw. The tendency to pull on the wires rather than the connector housing has the potential to damage the connector contact pins and/or the housing. This may be a service issue as well as an issue on the production line. When the opportunity is available, moving this solder bump slightly would be advised.

Change History (2)

comment:1 Changed 7 years ago by arnold

Quanta had modified the PC layout file to removed this solder bump already. This new motherboard will be implemented in the mass production stage.

comment:2 Changed 3 years ago by Quozl

  • Action Needed set to never set
  • Resolution set to fixed
  • Status changed from new to closed
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